By Yudhisthira Sahoo, Ph.D., technology specialist; Christopher Kowalczyk, incubator team leader; and Michael Merwin, mgr., Business & Technology Discovery, FLEXcon To date, the benefits of two-dimensional (2D) printed electronics have been widely realized when the printed flat components can be integrated into the target device without many design constraints. However, … [Read more...] about Thermoforming as a design tool in printed-electronics applications
Printed Electronics
Thermoset film offers soft, high-temperature-resistant stretchability for printed electronics: Part 1
By Andy Behr, technology mgr.-Panasonic Electronic Materials Division A primary factor limiting the deployment of printed electronics is a dearth of application-specific substrates. Conventional thermoplastic polymer films like TPU and PET, typically employed for printed electronics, exhibit poor temperature resistance and relatively high hysteresis, creating significant … [Read more...] about Thermoset film offers soft, high-temperature-resistant stretchability for printed electronics: Part 1
Ellipsometry on flexible substrates
By Nina Hong, Ph.D., applications physicist, J.A. Woollam Modern electronics are becoming thinner, lighter, more conformable, bendable or rollable. You now can fold your smartphone to fit in small pockets. You can wear your electronic devices to check email or monitor your daily physical activity. Augmented, Virtual and Mixed Reality (AR/VR/MR) devices allow you to … [Read more...] about Ellipsometry on flexible substrates
“Gap analysis” helps advance business, technology for flexible, hybrid, printed electronics
By Heidi Hoffman, senior dir.-SEMI Technology Communities Marketing, SEMI FlexTech SEMI FlexTech has been championing business and technology development of the flexible, hybrid, printed and organic electronics sector for 20+ years as the industry expanded to more than US$50 billion, with significant growth on the way. Driven by demands in mobile phones, automotive, flexible … [Read more...] about “Gap analysis” helps advance business, technology for flexible, hybrid, printed electronics
Are printed & flexible electronics finally on a roll?
By Matthew Dyson, Ph.D., senior technology analyst, IDTechEx Printing electronics as easily as newsprint has long been a compelling vision, promising cheaper circuits, sensors, solar panels and even displays. Known as roll-to-roll (R2R) electronics, it uses conductive and other functional inks printed onto flexible substrates. However, for many applications, R2R electronics … [Read more...] about Are printed & flexible electronics finally on a roll?