
With an investment of more than $110 million, Saica Group, one of the largest European players in the development and production of recycled paper for corrugated packaging, has begun to build its second Saica Pack plant in the US, a new corrugated manufacturing facility in Anderson, IN. Saica Pack is the Saica Group’s division dedicated to producing high-performance, corrugated-packaging solutions.
At a groundbreaking ceremony held Oct. 22, the company officially celebrated the construction on its new state-of-the-art factory.
Susana Alejandro, president/CEO of Saica Group, says, “Saica is committed to stability and long-term growth in the US. This investment is proof that we are moving forward with our plans in the US as we are convinced that we can provide products that will differentiate us in a crowded market. It reflects our deep commitment to delivering exceptional service, as we believe our knowledge and experience in the production of lighter-weight containerboard and corrugated packaging will bring high-performance packaging to the US market while becoming more efficient in the use of materials.”
Factory operations are expected to begin in Q4 2026 with recruiting for management and technical positions beginning later this year. Within the first two years of operations, Saica anticipates creating more than 50 full-time jobs, potentially reaching over 100 full-time jobs once the plant is running at full capacity.
Designed with future growth in mind, the almost 350,000-sq-ft facility will produce more than 1,200,000 MSF of corrugated packaging. Shipping of paper rolls will be reduced to the plant being connected to a railroad line. This site will also serve as a backup plant for Saica Pack in Hamilton, OH, to reinforce supply-chain security. The site will include manufacturing, converting and production areas, along with a warehouse and office space. Being in Anderson, Saica expands its geographic reach in the Midwest, creating a stronger service platform for the future, the company says in a press release.

