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BOBST flexible packaging technology day

April 29

Join BOBST for an exclusive, hands-on event exploring the next evolution of water-based flexo printing and solvent-less lamination. The event will be held April 29, 2025, from 9:00 am – 4:00 pm at the BOBST Atlanta Competence Center.

Why Attend?
The Evolution of Water-Based Flexo & Solvent-Less Lamination
Learn how these technologies are driving sustainability and high-performance packaging solutions.
Expert Insights & Live Demonstrations
Industry leaders in ink, sleeves, anilox, plates, and adhesives will share best practices for optimizing print quality, control, and efficiency.
Process Control & Waste Reduction with Synaptik
Discover how Synaptik technology enhances repeatability, control, and sustainability in solvent-less lamination.
BOBST Connect & Real-Time Applications See how digitalization is transforming flexible packaging production with improved efficiency and smarter decision-making.

Limited spots available – Secure your seat today

BOBST team

For more information or to register, visit www.go.bobst.com/FPTechDays.

Details

Date:
April 29
Website:
https://go.bobst.com/FPTechDays

Organizer

BOBST